Metal Oxide Semiconductor

  Electronics

Metal Oxide Semiconductor


The MOS tube is a metal (metal)-oxide (oxide)-semiconductor (semiconductor) field effect transistor, or a metal-insulator (insulator)-semiconductor. The source and drain of the MOS tube can be reversed, and they are all N-type regions formed in the P-type backgate. In most cases, the two regions are the same, even if the two ends are reversed, it will not affect the performance of the device. Such devices are considered symmetrical.


 


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Basic Information


Name: Metal Oxide Semiconductor


Abbreviation: MOS


Model: Voltage/Current Package


 


Metal Oxide Varistor Specifications / Definition


Field Effect Transistor (FET), which converts changes in input voltage into changes in output current. The gain of a FET is equal to its transconductance, defined as the ratio of a change in output current to a change in input voltage. N-channel and P-channel are commonly found on the market. For details, refer to the picture on the right (P-channel depletion MOS transistor). The P channel is commonly used as a low-voltage mos tube.


 


Field effect transistors affect the current flowing through the transistor by projecting an electric field on an insulating layer. In fact, no current flows through this insulator, so the GATE current of the FET tube is very small. The most common FET uses a thin layer of silicon dioxide as an insulator under the GATE. Such transistors are called metal-oxide-semiconductor (MOS) transistors, or, metal-oxide-semiconductor field-effect transistors (MOSFETs). Because MOS transistors are smaller and more power efficient, they have replaced bipolar transistors in many applications.


 


Construction of Field Effect Transistor:


A field-effect transistor (FET) is a type of transistor that uses an electric field to control the flow of current. MOSFETs are a type of FET that use a metal oxide semiconductor as the insulating layer between the gate and the channel. The construction of a MOSFET involves depositing a layer of oxide on a silicon substrate, followed by the deposition of metal contacts to create the source, drain, and gate electrodes. The gate electrode is separated from the channel by the oxide layer, and the gate voltage controls the channel conductivity.


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 Published date:

February 26, 2024

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